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Boron-Doped Single Crystal Diamond (MPCVD)

Boron-Doped Single Crystal Diamond (MPCVD)

Boron-Doped Single Crystal Diamond (MPCVD)

Product Properties:

Boron-Doped Single Crystal Diamond (MPCVD)

Applications

Boron-Doped Single Crystal Diamond (MPCVD) 

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1. General Description

Boron-doped single crystalline diamond plates synthesized via Chemical Vapor Deposition (CVD), offering tunable electrical properties from semiconducting to highly conductive regimes while maintaining diamond’s superior thermal conductivity, hardness, and chemical stability.


2. Dimensions & Physical Properties

ParameterSpecification
Lateral Size2 × 2 mm² to 10 × 10 mm²
Standard Sizes4 × 4 × 0.3 mm / 5 × 5 × 0.3 mm
Thickness~300 μm (substrate), customizable
Surface Roughness (Ra)≤ 2 nm
Crystal TypeSingle Crystal
Orientation(100) typical (customizable)

3. Doping Specifications (Boron, B)

PropertyLightly DopedHeavily Doped
Boron Concentration1×10¹⁵ – 1×10¹⁷ cm⁻³1×10¹⁸ – 1×10²⁰ cm⁻³
Doped Layer Thickness≤ 300 μm≤ 50 μm
Electrical Resistivity10³ – 10⁶ Ω·cm10⁻² – 10² Ω·cm
Carrier Typep-typep-type (degenerate possible)
Hole Mobility10 – 1000 cm²·V⁻¹·s⁻¹1 – 10 cm²·V⁻¹·s⁻¹

4. Electrical & Thermal Characteristics

  • Conductivity Range: Tunable from insulating to quasi-metallic

  • Carrier Transport: Temperature-dependent, reduced mobility at high doping levels

  • Thermal Conductivity: Up to ~2000 W/m·K (reduced with heavy doping)

  • Breakdown Field: >10 MV/cm


5. Surface & Quality

  • Optical-grade polishing available

  • Low defect density

  • High thickness uniformity (±10 μm typical across wafer)

  • Excellent surface planarity


6. Available Configurations (Based on Samples)

SizeDopingQuantity Example
4 × 4 × 0.3 mmB (1E17, ~3 μm doped layer)5 pcs
4 × 4 × 0.3 mmB (1E20)5 pcs
5 × 5 × 0.3 mmB (1E20)5 pc
MOQ: 1 pcs


7. Key Features

  • Wide tunability of electrical properties via boron doping

  • Exceptional thermal management capability

  • High chemical and radiation resistance

  • Compatible with microfabrication and electronic device processing


8. Typical Applications

  • High-power electronics

  • Electrochemical electrodes (BDD electrodes)

  • Heat spreaders with electrical functionality

  • Quantum and semiconductor research

  • Radiation detectors


9. Packaging & Delivery

  • Individually packed in anti-static protective crystal boxes

  • Cleanroom-compatible packaging

  • Standard shipping batches available


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