DIASEMI Diamond Inside

Diamond-Based High-Frequency Filters: A New RF Technology Platform

The commercialization of 3.5 GHz diamond-based surface acoustic wave (SAW) filters with DIASEMI diamond embeded marks an important step toward using diamond as a functional material for next-generation RF electronics.

Diamond combines ultra-high thermal conductivity, wide bandgap, high breakdown field, high mechanical strength, and excellent high-frequency characteristics, offering a compelling solution for high-power and high-frequency communication devices.

The key innovation goes beyond material substitution. By integrating large-area diamond films, heavily doped piezoelectric layers, and multilayer wafer processing, diamond-based RF filter wafers can achieve simplified manufacturing and improved device integration.

An impressive 45% smaller device dimensions and up to ~90% lower manufacturing cost, while reducing the number of lithography steps from approximately 20 to only 2.

For 5G, Wi-Fi, mmWave, and emerging sub-THz/THz systems, diamond can serve not only as a thermal-management material, but as a core RF functional material and device platform.

DIASEMI’s technology vision is to leverage diamond’s exceptional thermal, electrical, and high-frequency properties to enable the next generation of high-power, high-frequency, mmWave, and THz electronics.

Diamond is evolving from a “super thermal material” into a core platform for advanced RF electronics.