DIASEMI CVD Diamond Patternization

DIASEMI CVD Diamond Patternization

DIASEMI develops advanced CVD diamond patternization technologies for next-generation semiconductor, RF, and advanced packaging applications. By combining high-quality CVD diamond with precision lithography, plasma etching, laser processing, and surface engineering, DIASEMI enables diamond structures to be patterned into micro-scale thermal, electrical, and mechanical architectures.

DIASEMI’s patternization platform supports the fabrication of microchannels, trenches, openings, heat-dissipation structures, and Through-Diamond Vias (TDVs) with high dimensional accuracy and controlled sidewall geometry. These capabilities enable CVD diamond to evolve from a conventional heat-spreading material into an active three-dimensional platform for thermal management and heterogeneous semiconductor integration.

Particular emphasis is placed on high-aspect-ratio patterning, low-damage etching, surface integrity, and ultra-low roughness, which are critical for thin CVD diamond films and wafer-level bonding. By integrating patternization with precision polishing, metallization, and planarization, DIASEMI provides a scalable technology pathway for diamond heat spreaders, RF substrates, GaN-on-diamond platforms, advanced interposers, and TDV-enabled 3D packaging.

Through precise control of diamond geometry at the micro- and sub-micron scale, DIASEMI aims to unlock the unique combination of ultra-high thermal conductivity, electrical insulation, mechanical strength, and dimensional stability offered by CVD diamond for high-power and high-frequency semiconductor systems.