Diamond and Aluminum Composite

Applications

DIASEMI Diamond Aluminum Composite Heatsink

Item #	Density (g/cm³)	Thermal Conductivity (W/m.K)	CTE (10⁻⁶/K)	Flexural strength (Mpa)
DSDA500	3.0	≥500	≥8.0	≥300
DSDA550	3.1	≥550	≥7.0	≥300
DADD650	3.2	≥650	≥6.0	≥300

High thermal conductivity
Low thermal expansion
Low density
Flexible dimaond content
Solderability of Ni,Au
Surface roughness Ra :<100nm
Versatile Applications :GaAs; GaN, SiC…