Copper Diamond Composites

Copper Diamond Composites

In diamond/copper composites, diamond particles with diameters ranging from tens to hundreds of micrometers are typically used. The thermal conductivity of the composite material is adjusted by varying the volume fraction of diamond. Therefore, the particle size and volume fraction of the diamond in the composite are the main factors influencing its thermal conductivity.

The thermal conductivity of diamond/copper composites can change significantly, while the coefficient of thermal expansion is largely influenced by the volume fraction of diamond. For applications requiring a matched coefficient of thermal expansion, an appropriate diamond volume fraction can first be determined experimentally to meet the desired thermal expansion. Subsequently, other parameters can be adjusted to improve the composite's thermal conductivity, ultimately resulting in a high thermal conductivity diamond/copper composite that meets the application requirements.