Al/Diamond Composites With Boron

Al/Diamond Composites With Boron

Bullet-Point Summary:

• Problem: Advanced electronics generate extremely high heat flux (10³–10⁴ W/cm²), exceeding the capacity of traditional packaging materials like Al/SiC.

• Potential Solution: Al/diamond composites offer excellent thermal properties, but suffer from interface degradation due to Al₄C₃ formation.

• Challenge: Al₄C₃ is hygroscopic and causes poor interfacial bonding and reliability issues.

• Strategy: Surface modification of diamond particles with boron (B) forms a B₄C coating that:

• Improves wettability with the Al matrix.

• Suppresses Al₄C₃ formation.

• Reduces phonon mismatch and thermal resistance.

• Method:

• B coating applied via vacuum thermal diffusion.

• Al/B-diamond composites fabricated using gas pressure infiltration.

• Results: Improved interfacial microstructure and enhanced thermal conductivity/expansion compatibility.

• Conclusion: B₄C-coated diamond particles are effective for producing thermally efficient and stable Al matrix composites.