Phonon Bridge Engineering for Enhanced Interfacial Thermal Transport in Si/Diamond Heterostructure
Phonon Bridge Engineering for Enhanced Interfacial Thermal Transport in Si/Diamond Heterostructure
morePhonon Bridge Engineering for Enhanced Interfacial Thermal Transport in Si/Diamond Heterostructure
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November-2025
Curved Graphite Precursors Enable Cubic–Hexagonal Diamond Heterostructures with Unprecedented Toughness–Hardness Synergy”
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November-2025
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November-2025
Depositing a diamond coating on a titanium substrate
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November-2025
High-Quality Thick Single-Crystal Diamond for Next-Generation Electronics
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November-2025
Relieving the Residual Stresses in Diamond/Copper Combination Using Y₂W₃O₁₂ NTE Particles Doped Ag-Based Filler Alloys
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October-2025
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July-2025
High thermal conductive capillary architecture Cu-diamond composite heat sink
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May-2025
Copper doped DLC Diamond Like Carbon Coating for Antibacterial Application
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May-2025
Generation, Suppression, Application and Measurement of Stress in CVD Diamond Films
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May-2025
Ion-Implantation, Epilayer Growth, and Lift-Off of High-Quality Diamond Films
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May-2025
processing of polycrystalline diamond wafers through removing growth stress
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May-2025
GaSb membrane wafer integrated with CVD diamond heat spreaders
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June-2025
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June-2025
13
June-2025
Diasemi DiSiC™: Advanced Diamond–Silicon Carbide Composite for Next-Gen Thermal Management
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June-2025
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June-2025
Laser Slicing Ablation of CVD Diamond Wafer Membranes
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June-2025
Metallized diamond deposition and heat transfer characteristics in supersonic laser deposited diamond/Cu composite coating
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September-2025
17
July-2025
Diamond and Metal ;Diamond and Ceramic Composite Heatsinks
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November-2025
19
July-2025
31
July-2025
31
July-2025
3
August-2025