Diasemi — Cooling the Future, One Layer at a Time

Diasemi — Cooling the Future, One Layer at a Time.

Single Crystalline Diamond Nanowire

Single Crystalline Diamond Nanowire

Diasemi —Diamond (111) Homoepitaxy via Hot-Filament CVD: Growth Mode, Transition-Metal Incorporation, and Twin Formation

Diamond (111) Homoepitaxy via Hot-Filament CVD: Growth Mode, Transition-Metal Incorporation, and Twin Formation

Ti-Based Phonon-Bridged Cu/Diamond Interfaces for Ultra-High Thermal Performance

Tungsten–Diamond Composite for Extreme Heat Flux Plasma-Facing Components

Tungsten–Diamond Composite for Extreme Heat Flux Plasma-Facing Components

Diamond and Metal ;Diamond and Ceramic Composite Heatsinks

Diamond and Metal ;Diamond and Ceramic Composite Heatsinks

High-Quality Thick Single-Crystal Diamond for Next-Generation Electronics

High-Quality Thick Single-Crystal Diamond for Next-Generation Electronics

Depositing a diamond coating on a titanium substrate

Depositing a diamond coating on a titanium substrate

CVD Diamond Deposition Coating on Titanium Thermal Management

Curved Graphite Precursors Enable Cubic–Hexagonal Diamond Heterostructures with Unprecedented Toughness–Hardness Synergy

Curved Graphite Precursors Enable Cubic–Hexagonal Diamond Heterostructures with Unprecedented Toughness–Hardness Synergy”

Diamond TPMS with SLM-Fabricated CuCrZr

Diamond TPMS with SLM-Fabricated CuCrZr

Petal-shaped pin-fin microchannel heat sink

Petal-shaped pin-fin microchannel heat sink