Applications
Copper and Diamond Composite Heat Sink ,Microfluidic channel Pin Fin
Flexible diamond and copper volume content
Adjustable thermal expansion rate
Various diamond and copper particle size selection and weavable precise matrix layout
Decades of experience and knowhow of diamond and copper particle metalization to improve wettability
Complex shape and extra small -large size supported with existing mold and tools
Extra thin and strong surface metalization of Ni,Au, Ag, Pt etc
Super fine nanometer surface roughness /flatness ready for smooth integration into electronic and semiconductor devices
