Copper Diamond Composite, high thermal conductivity and diffusivity

Applications

Ultra high thermal conductive and high thermal dissfusive diamond and copper composite heatsink substrate

Plated with gold and platinium

Au Pt Coated

Flexible diamond copper percentage content

Diamond particle sizes and metalization treatment customizable

Adjustable CTE

Secondary drilling trenching assembling etc machining supported

Copper Diamond Composite Au Pt Plated.jpg

Copper Diamond Composite Heat Sink.jpg

Only DIASEMI SEMIXICON