Copper Diamond Composite Heatsink Semixicon Diasemi

Copper Diamond Composite Heatsink Semixicon Diasemi
Copper Diamond Composite Heatsink Diasemi
Any size up to 150 um
Thermal conductivity up to 1000 W/mk
Metalization optional of Cu, Ag, Au etc
Surface roughnes of nanometer
Diamond content particle size and layout can be structured and fine tuned