Fine-diamond/copper composites fabricated using pressure-assisted infiltration
August30, 2025
Fine-diamond/copper composites were fabricated using pressure-assisted infiltration (PAI)
| Process Parameter | Nano-W coated | Uncoated |
|---|---|---|
| Diamond particle size | 100 μm | 100 μm |
| Diamond volume fraction | 63 vol.% | 60–65 vol.% |
| Infiltration temperature | 1150 °C | 1100–1150 °C |
| Infiltration time | 30 min | 30–60 min |
| Applied pressure | 3 MPa | 3 MPa |
| Thermal conductivity (measured) | 811 W·m⁻¹·K⁻¹ | 550–700 W·m⁻¹·K⁻¹ |
| DEM model prediction | ~853 W·m⁻¹·K⁻¹ | ~850 W·m⁻¹·K⁻¹ |
| Efficiency vs. DEM (η) | >95% | 65–80% |
| Performance enhancement mechanism | Nano-W coating, suppressed graphitization | Limited interfacial bonding, partial graphitization |
SEMIXICON DIASEMI
