High-Performance Titanium Diamond Matrix Composite for Extreme Environments
High-Performance Titanium Diamond Matrix Composite for Extreme Environments
1. Product Overview
DIASEMI™ TC4/Diamond Composite is an advanced titanium matrix composite engineered by integrating TC4 titanium alloy with high-purity diamond particles. The material is consolidated via spark plasma sintering and can be further functionalized with chemical vapor deposition.
This hybrid architecture delivers a unique combination of:
High strength-to-weight ratio
Exceptional hardness and wear resistance
Tunable thermal expansion
Enhanced thermal management capability
2. Key Features
Diamond Reinforcement Improves hardness, wear resistance, and thermal conductivity
Engineered Interface (TiC Layer) In-situ formation of TiC enhances bonding and load transfer
CTE Matching Capability Adjustable coefficient of thermal expansion for system integration
CVD-Compatible Surface Direct growth of diamond films for extreme surface performance
Enhanced Densification (Optional Cu Phase) Improved consolidation without compromising microstructure
3. Typical Properties
4. Microstructure Description
The composite consists of:
TC4 matrix (continuous phase)
Dispersed diamond particles
Interfacial TiC transition layer
Functional Mechanism:
Diamond → load bearing + thermal conduction
TiC → interfacial bonding + stress transfer
TC4 → structural integrity
5. Surface Engineering Option
CVD Diamond Coating Capability
Continuous diamond film achievable after ~4 hours deposition
Strong adhesion via TiC interlayer
Uniform morphology with optimized filament tension
Performance Enhancement:
Ultra-low friction coefficient
Extreme wear resistance
Improved thermal flux handling
6. Manufacturing Process
Step 1 – Powder Preparation
TC4 powder + diamond powder
High-energy ball milling for uniform mixing
Step 2 – Consolidation
Spark plasma sintering (SPS)
Controlled temperature, pressure, and dwell time
Step 3 – Surface Functionalization (Optional)
Hot filament CVD diamond deposition
Stress-controlled filament alignment
7. Design Flexibility
8. Applications
Aerospace
Lightweight wear-resistant components
Thermal-structural parts
Semiconductor Equipment
Precision handling components
Vacuum-compatible structures
Tribology
Bearings and sliding interfaces
High-load wear systems
Biomedical
Biocompatible implants
Surgical tools
9. Competitive Advantages
Integrated bulk + surface engineering
Strong interfacial bonding via TiC
Scalable SPS + CVD manufacturing
Tunable thermal and mechanical properties
10. Customization Options
DIASEMI provides:
Diamond particle size & fraction tuning
Custom geometry (plates, discs, complex shapes)
Surface coating (thickness, roughness, grain size)
Hybrid structures (Cu-enhanced densification)
11. Ordering Information
12. Quality & Testing
SEM microstructure analysis
Raman spectroscopy (diamond quality)
Density & porosity measurement
Hardness and mechanical testing
Thermal expansion & conductivity characterization
13. Disclaimer
Values shown are typical and may vary depending on processing conditions and customization. DIASEMI recommends application-specific validation.
5/18/2026
San Francisco ,CA, USA
