Laser Slicing Ablation of CVD Diamond Wafer Membranes
June17, 2025
Laser Slicing Ablation of CVD Diamond Wafer Membranes
A novel laser slicing ablation technique has been developed in Diasemi for efficient thinning of chemical vapor deposition (CVD) diamond wafers, significantly reducing material loss and processing time. Compared to conventional mechanical or plasma etching methods that require several hours to thin 500 μm thick wafers down to 100 μm or less, this laser-based approach accomplishes the same task in under 30 minutes. With precision slicing capabilities down to 1–6 μm thickness, this method enables the scalable production of ultra-thin diamond membranes suitable for advanced applications such as SBD FETs, diamond heatsinks, GaN-on-diamond RF devices, automotive and 5G/6G power modules, laser optical windows, AR/VR components, and NV center-based quantum technologies.
Besides slicing, laser microfabrication such like polishing ,lapping,hole drilling chamfering is placing an ever increasing important role in CVD diamon products machining ,
