Diasemi DiSiC™: Advanced Diamond–Silicon Carbide Composite for Next-Gen Thermal Management

Diasemi DiSiC™: Advanced Diamond–Silicon Carbide Composite for Next-Gen Thermal Management

Overview:
Diasemi's DiSiC™ composite is a cutting-edge diamond–ceramic hybrid material engineered to meet the intense thermal demands of modern AI data centers and high-performance computing (HPC) platforms. By combining diamond’s unparalleled thermal conductivity with the structural integrity of silicon carbide, DiSiC delivers superior thermal performance and system compatibility.

Key Features & Benefits:

• Exceptional Thermal Conductivity:
  DiSiC achieves isotropic thermal conductivity exceeding 800 W/m·K, more than twice that of copper, the current industry standard.

• CTE Matching with Silicon:
  The composite’s coefficient of thermal expansion (CTE) is closely matched to that of silicon, ensuring mechanical compatibility and reliability in direct die attach and packaging applications.

• Operational Advantages:

• Enables longer component lifetimes and higher power densities

• Reduces cooling complexity and lowers datacenter energy consumption, where cooling can account for up to 50% of total energy use

• Improves system-level thermal efficiency, allowing for higher throughput and more compact designs

• Rugged and Versatile:
  DiSiC is electrically insulating, corrosion-resistant, and mechanically robust across a wide temperature range, making it ideal for harsh and demanding environments.

Application Areas:

• Direct-to-chip heat spreaders

• Microchannel cold plates (single-phase and two-phase)

• Power semiconductor substrates

• Advanced embedded cooling architectures

• Replacements for copper where performance and thermal expansion are critical

Why DiSiC Matters:
With AI workloads and HPC systems pushing thermal envelopes higher than ever, traditional materials like copper and aluminum oxide are no longer sufficient. Diasemi DiSiC™ represents a breakthrough in thermal materials science—providing a scalable, high-performance solution that supports the future of data infrastructure.