Diamond Metallization

Diamond Metallization Solutions for High-Power Applications

At Diasemi, we specialize in advanced metallization techniques tailored for high-power electronic applications involving diamond materials. Our standard and custom metallization stacks are engineered to ensure strong adhesion, thermal stability, and electrical performance.

Standard Metallization Scheme

Our most commonly used metallization stack is optimized for bonding devices to diamond heat spreaders and includes:

• Titanium (Ti) – 1,000 Å (adhesion layer, carbide-forming)

• Platinum (Pt) – 1,000 Å (diffusion barrier)

• Gold (Au) – 10,000 Å (final bonding/contact layer)

This three-layer structure balances mechanical adhesion, chemical stability, and excellent solderability or wire-bonding performance.

Layer Functionality

1. Adhesion Layer
   The first layer consists of a carbide-forming metal—typically titanium, tungsten, or chromium—which chemically bonds to the diamond surface to ensure robust adhesion.

2. Diffusion Barrier
   A layer of platinum or palladium is applied to prevent interdiffusion between the active metal layer and the final metal layer, preserving electrical and structural integrity.

3. Contact/Bonding Layer
   The final layer, usually gold or silver, provides the surface required for soldering, eutectic bonding, wire bonding, or acting as an electrical contact.

Additional Capabilities

• Patterned Metallization: We support full-wafer processing with precision patterning and laser texturing/ dicing to ensure electrical isolation between pads and ground planes.

• Annealing Options: Metallized layers can be annealed in air or vacuum to further enhance film properties.

• Custom Layer Stacks: Our team routinely develops multilayer metallization stacks with up to five or more layers, incorporating different adhesion, reflective, or contact layers to meet unique performance requirements.

Application Flexibility

Whether diamond is used as an active device material or a passive heat spreader, our metallization processes provide reliable integration with a variety of device architectures.

Have specific requirements? We offer custom solutions and welcome the opportunity to help solve your metallization challenges.