Diamond-Si/Al composites

The advancement of electronic devices has increased the need for efficient thermal management materials due to rising heat generation. Metal matrix composites (MMCs), especially those reinforced with diamond, are promising due to their high thermal conductivity and adjustable thermal expansion. However, poor bonding between diamond and metal matrices, particularly aluminum, limits performance. Coating diamond particles with a third phase, such as silicon, has been shown to improve bonding and thermal conductivity. Silicon is particularly effective because it forms strong bonds with diamond, reduces wettability issues, suppresses the formation of unstable aluminum carbide, and enhances interface stability. 

Recent study suggests that using silane chemical vapor deposition (CVD) to coat diamond particles with silicon, optimizing the process parameters to enhance interfacial bonding and thermal performance of diamond/Al composites. 

The immediate goal is to create lightweight, high-conductivity materials for electronic packaging.