Dual side diamond deposition on copper crack free minimal warpage thermal heatsink

Dual side diamond deposition on copper crack free minimal warpage thermal heatsink 

Current markets are seeking advanced thermal management materials that combine ultra-high thermal conductivity with electrical insulation for high-power electronics. 

Diamond/copper composites show strong thermal conductivity (500–800 W/m·K) but lack insulation, while AlN and Al₂O₃ offer insulation but insufficient heat dissipation. To overcome these limits, a dual-side heterogeneous deposition strategy was developed: nanocrystalline diamond is first deposited on one side of copper to absorb thermal strain, followed by microcrystalline diamond on the other to balance stress. 

This method reduces warpage, prevents cracking, and delivers superior cooling performance, lowering device temperatures significantly compared with AlN and Al₂O₃.